Semiconductor Value Chain
Design, Fabrication and ATMP/OSAT
The semiconductor industry is structured across distinct stages: chip design (fabless design houses create circuit layouts), fabrication (foundries manufacture chips on silicon wafers using processes measured in nanometres), and ATMP/OSAT (Assembly, Testing, Marking and Packaging / Outsourced Semiconductor Assembly and Test — packaging the finished chip and testing it for use). Most of India's operational projects so far are in the ATMP/OSAT stage, which is less capital-intensive than fabrication.
- Micron Technology's ATMP facility in Sanand, Gujarat is the first operational unit of the current mission cycle
- Tata Semiconductor's Dholera project (Gujarat) is India's first commercial fabrication (fab) facility, using technology sourced via Taiwan's PSMC at the 28-nanometre node, with first silicon targeted for late 2026 — a $11 billion-scale project
- Tata Semiconductor Assembly and Test (TSAT) in Jagiroad, Assam is the largest single ISM project by investment, focused on memory and logic ATMP
- Lower node numbers (e.g., 3nm, 5nm) denote more advanced, smaller transistor sizes used in high-performance chips (smartphones, AI processors); higher nodes like 28nm, targeted by India's first fab, suit automotive, power and industrial applications — precisely the "cars, TVs, power infra" segments named in this announcement
● Tracked since February 07, 2026 · last seen September 20, 2026 · updates as the daily brief publishes
18 Jul '26
India Semiconductor Mission 2.0: Building the Value Chain Beyond Fabrication
Science & Technology
15 Jul '26
Semicon Mission 2.0 Approved: ₹1.27 Lakh Crore for India's Chip Ecosystem
Science & Technology
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